Packaging – Learn about Future Trends and Solutions
The 4th ISTA European Packaging Symposium, organized
by ISTA and the Fraunhofer Institute, will be held November
6 & 7 at Fraunhofer’s facilities in the Dortmund,
Germany. Speakers including Ericsson, CHEP, Bonn University,
Lufthansa Cargo, BSH, HP, BFSV, DHL, Smithers-PIRA, Sealed
Air, Fraunhofer IML, INCPEN, and others, will bring case studies
as well as new information during this valued event.
This Symposium offers rich opportunity for increasing
brand value by delivering reduced damage, reduced costs and
elimination of unnecessary use of materials, as well enhanced
customer service through increased reliability and improved
lead times. Attend the event, meet the industry experts, and
learn how to access this unlocked value.
Presentations will give a practical insight into
economic and environmental optimisation of packaging for distribution,
and on latest techniques in pre-shipment testing of packaged
products, and on sustainability in packaging. The event will
provide practical benefit to delegates on the critical link
between packaging and logistics, focusing on cost savings
and delivering against sustainability requirements.
The event will appeal to packaging users and
producers as well as retailers and other supply chain stakeholders;
content will be relevant to the range of market sectors, from
consumer goods and electronics, to industrial products and
This ISTA event is hosted by Fraunhofer
IML, based in Dortmund, promising great networking and
an enjoyable and informative event, building on the success
of the last three year’s events.
ADDED SYMPOSIUM BONUS:
Discover the Advantages of Being Certified!
Become an ISTA Certified Packaging Laboratory
Professional (CPLP) while attending the European Packaging
Symposium! CPLP Technician and Technologist sessions will
be offered after the Symposium on November 8 & 9 and will
be conducted by David Shires from Smithers Pira. CLICK
HERE FOR MORE INFORMATION